Substrate processing apparatus and driving method thereof

ABSTRACT

The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2019-0080129, filed on Jul. 3, 2019, the disclosureof which is incorporated by reference herein in its entirety.

BACKGROUND 1. Field

The present disclosure relates to a substrate processing apparatuscapable of preventing and/or suppressing breakage of a lift pin and adriving method thereof.

2. Description of Related Art

As a lift plate of a substrate processing apparatus rises, a pluralityof lift pins rise. As a result, the lift pins push up the substrate(e.g., a wafer) disposed on a chuck. The lift plate may be raised orlowered while the lift pins are inclined. In this case, the lift pinsmay be pinched in the pin holes of the chuck, thereby causing the liftpins to be damaged and/or broken. In addition, the lift plate may beraised or lowered while the lift plate is inclined. In this case, thelift pins may be pinched in the pin holes and damage to the lift pinsmay occur. In addition, foreign matter or particles may be present atthe bottom of the lift plate. When foreign matter or particles come intocontact with the bottom surface of the lift pin(s), the lift pin(s) maytilt. As a result, the lift pin(s) may be caught in the pin holes, andthe lift pins may be damaged and/or broken.

SUMMARY

Aspects of the present disclosure are related to a substrate processingapparatus. The substrate processing apparatus may include a chuckincluding a plurality of pin holes and a plurality of lift pinspositioned to rise and fall through the plurality of pin holes. Thesubstrate processing apparatus may include a lift plate configured toraise and lower the lift pins. The plurality of lift pins may include alift pin having a rod shape configured to move up and down in a pin holeof the plurality of pin holes, a flexure coupled to a lower portion ofthe lift pin, a weight body positioned underneath the lift plate, and aweight string connecting the flexure and the weight body. The lift platemay include a string hole through which the weight string passesthrough.

Additional aspects of the present disclosures are related to a substrateprocessing apparatus. The substrate processing apparatus may include achamber and a chuck disposed in the chamber. The chuck may include aplurality of pin holes. The substrate processing apparatus may include aplurality of lift pins positioned to rise and fall through the pluralityof pin holes, and a lift plate configured to raise and lower theplurality of lift pins. The plurality of lift pins may include: a liftpin having a rod shape, the lift pin being configured to move up anddown within a pin hole of the plurality of pin holes, and a flexurecoupled to a lower portion of the lift pin.

Additional aspects of the present disclosures are related to a substrateprocessing apparatus. The substrate processing apparatus may include achamber and a chuck disposed in the chamber. The chuck may include aplurality of pin holes. The substrate processing apparatus may include aplurality of lift pins positioned to rise and fall through the pluralityof pin holes, and a lift plate configured to raise and lower theplurality of lift pins. The plurality of lift pins may include: a liftpin having a rod shape, the lift pin being configured to move up anddown within a pin hole of the plurality of pin holes, a weight blockcoupled to a lower portion of the lift pin, a weight body positionedbeneath the lift plate, and a weight string connecting the weight blockand the weight body. The lift plate may include a string hole throughwhich the weight string is configured to pass through.

According to embodiments according to the present disclosure, when thelift plate pushes up the lift pin unit, the lift pin may be verticallyaligned in the pin hole while the flexure is deformed in the X and Yaxis directions. When the lift plate is raised and lowered, it ispossible to prevent and/or suppress the lift pins from breaking.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will become apparent to those of skill in the art by describingin detail exemplary embodiments with reference to the attached drawingsin which:

FIG. 1 is a substrate processing apparatus according to an exemplaryembodiment of the present disclosure, and illustrates a lift up state inwhich a lift pin unit is raised.

FIG. 2 is a substrate processing apparatus according to an embodiment ofthe present disclosure, and illustrates a lift down state in which alift pin unit is lowered.

FIG. 3A is a diagram illustrating a lift pin unit and a lift plateaccording to one embodiment of the present disclosure.

FIG. 3B is a view illustrating a lift pin unit and a lift plateaccording to one embodiment of the present disclosure.

FIG. 4A is a view illustrating a lift pin unit and a lift plateaccording to an embodiment of the present disclosure.

FIG. 4B is a view illustrating a lift pin unit and a lift plateaccording to one embodiment of the present disclosure.

FIG. 5 is a view illustrating an example of the flexure.

FIG. 6 is a view illustrating an example of a flexure.

FIG. 7 is a view illustrating a lift pin unit and a lift plate accordingto an exemplary embodiment of the present disclosure.

FIG. 8 is a view illustrating a lift pin unit and a lift plate accordingto an exemplary embodiment of the present disclosure.

FIG. 9 is a view illustrates a lift pin unit and a lift plate accordingto an exemplary embodiment of the present disclosure.

FIGS. 10 to 12 are views illustrating a method of driving a substrateprocessing apparatus according to an embodiment of the presentdisclosure.

FIG. 13 is a view illustrating a flow chart for a method ofmanufacturing a semiconductor device.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, semiconductor packages according to example embodiments ofthe inventive concept will be described with reference to theaccompanying drawings.

FIG. 1 is a substrate processing apparatus 10 according to an exemplaryembodiment of the present disclosure, and illustrates a lift up state inwhich a lift pin unit 200 is raised. FIG. 2 is a substrate processingapparatus 10 according to an embodiment of the present disclosure, andillustrates a lift down state in which a lift pin unit 200 is lowered.

Referring to FIGS. 1 and 2 , a substrate processing apparatus 10according to an embodiment of the present disclosure is an apparatus forprocessing a substrate 20 (e.g., a wafer) to manufacture a semiconductordevice. The substrate processing apparatus 10 may include a chamber 110,a chuck 120, a chamber window 130, a plurality of lift pin units 200,and a lift plate 140, a driving unit 150, and a chamber support plate160.

The substrate 20 may be seated on the chuck 120. The chamber window 130may be formed on one side of the chamber 110. The chamber window 130 mayinclude a transparent window for visually confirming a progress state ofthe process from the outside. The plurality of lift pin units 200 maysupport a lower portion of the substrate 20 and move up and down. Thelift plate 140 may raise or lower the plurality of lift pin units 200.The driving unit 150 may drive the lift plate 140 up and down. Thechamber support plate 160 may support the chamber 110.

A space for disposing the substrate 20, the lift pin unit 200, and thelift plate 140 may be provided in the chamber 110. The chamber 110 maybe a physical vapor deposition (PVD) chamber or a chemical vapordeposition (CVD) chamber, for example.

The substrate 20 may be loaded into the chamber 110. The chuck 120 mayhave a flat upper surface on which the substrate 20 loaded into thechamber 110 is seated. The chuck 120 may fix the substrate 20 using avacuum or electrostatic method. The chuck 120 may include a heatertherein (not illustrated). The substrate 20 mounted on the chuck 120 maybe heated to a predetermined temperature by the heater. In addition, thechuck 120 may further include a cooler (not illustrated). The substrate20 heated during the manufacturing process may be cooled by the cooler.

A plurality of pin holes 122 may be formed in the chuck 120. Theplurality of pin holes 122 may be formed to penetrate the chuck 120 in avertical direction. A plurality of lift pins 210 (see FIG. 3A-9 ) may beinserted into the plurality of pin holes 122, respectively. Theplurality of lift pins 210 may support the substrate 20. The pluralityof pin holes 122 may be uniformly spaced apart from each other at apredetermined interval. The plurality of lift pins 210 may move up anddown through the plurality of pin holes 122. For example, each lift pin210 may be configured to move up and down in a corresponding pin hole122.

In the process of manufacturing a semiconductor device, variousmanufacturing processes such as deposition, coating, developing,etching, and cleaning may be repeatedly performed on the substrate 20.In order to proceed with manufacturing processes such as deposition,coating, developing, etching, and cleaning, the substrate 20 may beloaded into the chamber 110. When the individual manufacturing processis completed, the substrate 20 may be unloaded to the outside of thechamber 110.

When loading the substrate 20 into the chamber 110, the plurality oflift pin units 200 may be raised and lowered by using the lift plate140. For example, the lift plate may be configured to and/or positionedto raise and lower the plurality of lift pin units. The substrate 20 maymove up and down by raising and lowering the plurality of lift pin units200.

When unloading the substrate 20 to the outside of the chamber 110, theplurality of lift pin units 200 may be raised and lowered by using thelift plate 140. The substrate 20 may be moved up and down by raising andlowering the plurality of lift pin units 200.

FIG. 3A is a diagram illustrating a lift pin unit 200 and a lift plate140 according to one embodiment of the present disclosure.

Referring to FIGS. 1, 2, and 3A, the lift pin unit 200 may include alift pin 210 and a flexure 220. The lift pin 210 may include a tipportion 212 and a metal plate 214. The tip portion 212 may be disposedabove the lift pin 210. The metal plate 214 may be disposed below thelift pin 210.

The substrate 20 may be loaded into the chamber 110 using a robotic arm(not illustrated). The lift pin unit 200 may be moved up as the liftplate 140 rises.

The substrate 20 may be positioned on the tip portion 212 of the liftpin 210 of the lift pin unit 200. In order to proceed with themanufacturing process, the lift plate 140 may be moved down, and thusthe lift pin unit 200 may be lowered.

When the lift pin unit 200 descends, the substrate 20 may be seated onthe chuck 120. When the manufacturing process is completed, the liftplate 140 may rise to raise the lift pin unit 200. As the lift pin unit200 rises, the lift pin 210 may rise, and the substrate 20 seated on thechuck 120 may rise. When the substrate 20 is raised, the robotic arm mayunload the substrate 20 to the outside of the chamber 110.

An upper side 124 of the plurality of pin holes 122 may include afunnel-shaped recess. When the lift plate 140 is lowered, the tipportion 212 of the lift pin 210 may be inserted into the concave portionhaving a funnel-shaped recess.

If the lift pin 210 is inclined with respect to the vertical direction,the lift pin 210 may not be caught in the pin hole 122 as a result ofthe funnel-shaped recess of the upper side 124. To this end, an edgeportion of the upper side 124 of the plurality of pin holes 122 may beformed to be inclined or rounded. Since the edge portion of the upperside 124 may be inclined or rounded, the lift pin 210 may not be caughtin the pin hole 122 even when the lift pin 210 is inclined.

Also, the lower side 126 of the pin hole 122 may include a funnel-shapedrecess. The corner portion of the lower side 126 of the pin hole 122 mayalso be inclined or formed in a round shape. If the lift pin 210 isinclined with respect to the vertical direction, the lift pin 210 may beprevented from being caught in the corners of the upper side 124 and thelower side 126 of the pin hole 122.

The lift pin 210 of the lift pin unit 200 may have a rod shape and mayinclude a low friction ceramic or engineered plastic (e.g., vespel,peek). The lift pin 210 may have a smaller diameter than the pin hole122. For example, each lift pin 210 may correspond to a larger diameterpin hole 122.

The lift pin 210 may be inserted into the pin hole 122 to move up anddown. The tip portion 212 of the lift pin 210 may have an invertedtriangle, an inverted cone, or an inverted trapezoidal longitudinalsection. The tip portion 212 may have a diameter smaller than thediameter of the upper side 124 (upper portion) of the pin hole 122.

Also, the tip portion 212 may have a diameter larger than the diameterof the central portion of the pin hole 122. Therefore, even if the liftplate 140 descends fully to the end, the tip portion 212 of the lift pin210 may extend over the lower portion of the upper side 124. Therefore,the lift pins 210 do not fall out of the pin holes 122 when the liftplate 140 descends fully to a lift down state (see FIG. 2 ).

When the lift plate 140 is completely lowered, the tip portion 212 ofthe lift pin 210 may extend over the lower portion of the upper side 124of the pin hole 122. When the tip portion 212 spans the lower portion ofthe upper side 124 of the pin hole 122, it may be vertically aligned bythe weight of the lift pin 210.

The flexure 220 of the lift pin unit 200 may be bonded or fastened tothe lower portion of the lift pin 210. The metal plate 214 may be formedof a metal having magnetic properties (for example, iron, nickel,cobalt, etc.) and may be disposed below the lift pin 210. The metalplate 214 may be disposed below the lift pin 210, i.e., the metal plate214 may be disposed at or coupled to a bottom portion of the lift pin210. A magnet 222 may be disposed on the flexure 220, e.g., anelectrically magnetized metal or a permanent magnet 222 may be disposedat or coupled to a top portion of the flexure 220.

The metal plate 214 disposed under the lift pin 210 may be attracted tothe magnetism of the magnet 222 disposed above the flexure 220.Accordingly, the lift pin 210 and the flexure 220 may be magneticallycoupled at a junction of the metal plate 214 and magnet 222. Also, thelift pin 210 and the flexure 220 may be fastened through screws.

When the lift plate 140 is raised, the flexure 220 may be easilydeformed (or bent) in the X-axis and Y-axis directions so that the liftpins 210 may be vertically aligned. That is, when the lift plate 140 israised, the flexure 220 may first be bent before the lift pin 210 istilted. As the flexure 220 is bent, the lift pin 210 may also be raisedin a vertical direction. Also, the flexure 220 may be bent even when thelift pin 210 is inclined at a predetermined angle, e.g., a predeterminedangle within acceptable tolerance. Accordingly, the lift pins 210 may beraised in the vertical direction.

As an example, the flexure 220 may be formed in a serpentine shape bybending a plate structure made of a flexible material several times.Since the flexure 220 may be formed in a serpentine shape, when pressureis applied, the flexure 220 can be easily deformed in the X-axis andY-axis directions (can be bent).

When the lift plate 140 pushes up the lift pin unit 200, the lift pin210 may be pinched in the pin hole 122. In this case, the flexure 220may be vertically raised while also being deformed (bent) in the X and Yaxis directions. The lift pins 210 may be vertically aligned in the pinholes 122 to prevent breakage of the lift pins 210.

The driving unit 150 may control the rising and falling of the liftplate 140. The driving unit 150 may be a conventional driver (mechanicalactuator) such as a drive motor, a linear actuator, a micro linearactuator, a track actuator, a rod actuator, a voice coil motor, a linearmotor, and/or a hydraulic system. Additionally, driving unit 150 mayinclude a controller configured to send a signal that activates thedriving unit 150, e.g., mechanical actuator to raise and lower the liftplate 140. The term “controller” is meant to be used in its broadestsense to include one or more controllers, computers and/ormicroprocessors, and/or other computer hardware, and/or software, and/orcomputer implemented algorithms that may be associated with the drivingunit 150 and that may cooperate in controlling various functions andoperations of lift plate 140. The lift plate 140 may be raised andlowered by the control of the driving unit 150. As the lift plate 140 israised and lowered, the lift pin unit 200 may be raised and lowered.

The plurality of lift pin units 200 may be raised and lowered by the onelift plate 140. Alternatively, the plurality of lift pin units 200 maybe raised and lowered by a plurality of lift plates 140.

A slide stopper 142 may be formed on an upper surface of the lift plate140 to prevent the flexure 220 from sliding beyond a predeterminedrange. For example, the slide stopper 142 may prevent the flexure 220from sliding too far that the lift pin 210 is not in vertical alignmentwith the pin hole 122. That is to say that the slide stopper 142 may beconfigured to prevent the lift pin 210 from becoming verticallymisaligned by only allowing the flexure 220 to slide and/or deform by apredetermined amount. In this way, the slide stopper 142 is configuredto maintain the lift pin 210 in vertical alignment with the pin hole 122by retaining the flexure 220 within a predetermined range. The slidestopper 142 may be formed to surround side surfaces of the flexure 220.For example, the slide stopper 142 may have a ring like shape with acircular interior void space having an interior diameter. In thisexample embodiment, the interior diameter of the slide stopper 142 maybe the same as the diameter of the pin hole 122 or about the same as thediameter of the pin hole 122. The diameter of the slide stopper 142 isnot limited thereto, and may be larger than the diameter of the pin hole122. Space may be provided inside the slide stopper 142 so that theflexure 220 can be inserted, e.g., a circular interior void space. Whenthe lift plate 140 is raised and lowered, the flexure 220 may be locatedinside the slide stopper 142.

When the flexure 220 is deformed by an external pressure, the slidestopper 142 may limit the sliding of the flexure 220. That is, theflexure 220 may be prevented from sliding out beyond a predeterminedrange by the slide stopper 142. The slide stopper 142 may limit thesliding range of the flexure 220 so as not to deviate from the diameterof the pin hole 122. The slide stopper 142 may be configured to limitthe flexure 220 from horizontal movement so that the lift pin 210 doesnot deviate outside of a center axis in the vertical direction of thepin hole 122 and thus the lift pin 210 remains vertically aligned. Thelift pins 210 may be vertically aligned in the pin holes 122 to preventbreakage of the lift pins 210.

FIG. 3B is a view illustrating a lift pin unit 200-1 and a lift plate140-1 according to one embodiment of the present disclosure.

Referring to FIG. 3B, the substrate processing apparatus 10-1 mayinclude a chuck 120, a plurality of lift pin units 200-1, and a liftplate 140-1.

The lift pin unit 200-1 may include a lift pin 210, a flexure 220-1, anda weight body 230. The weight body 230 may be suspended from the flexure220-1 by a weight string 232.

A slide stopper 142 may be formed on an upper surface of the lift plate140-1 to prevent the flexure 220-1 from sliding beyond a predeterminedrange.

A plurality of string holes 144 may be formed in the lift plate 140-1.The string holes 144 may be formed at positions corresponding to theplurality of lift pin units 200-1. The weight string 232 may connect theflexure 220-1 and the weight body 230. The first side of the weightstring 232 may be connected to the lower portion of the flexure 220-1.The second side of the weight string 232 may be connected to the weightbody 230. Accordingly, the weight body 230 may be suspended from theflexure 220-1 by the weight string 232 which passes through acorresponding string hole 144.

A plurality of weight strings 232 may pass through the lift plate 140-1through a plurality of corresponding string holes 144. The weight body230 may be located below the lift plate 140-1. The weight body 230 maybe formed of a material having a specific gravity higher than that ofthe lift pin 210. The weight of the weight body 230 is added to theweights of the lift pins 210 and the flexure 220-1 so that the lift pins210 may be vertically aligned.

When the lift plate 140-1 is raised and lowered, the lift pins 210 maybe vertically aligned by the weight body 230. Even if the lift plate140-1 is inclined, the lift pins 210 may be vertically aligned by theweight body 230. The lift pins 210 may be vertically aligned in the pinholes 122 to prevent breakage of the lift pins 210. In addition, theflexure 220-1 may be deformed to the X-axis and the Y-axis by thepressure applied when the lift plate 140-1 rises. The lift pins 210 maybe vertically aligned in the pin holes 122 to prevent breakage.

FIG. 4A is a view illustrating a lift pin unit 200-2 and a lift plate140-2 according to an embodiment of the present disclosure.

Referring to FIG. 4A, the substrate processing apparatus 10-2 mayinclude a chuck 120, a plurality of lift pin units 200-2, and a liftplate 140-2.

The lift pin unit 200-2 may include a lift pin 210 and a flexure 220-2.

The flexure 220-2 may be bonded, coupled or fastened to the lowerportion of the lift pin 210. A metal plate 214 formed of a metal havingmagnetic properties (for example, iron, nickel, cobalt, etc.) may bedisposed below the lift pin 210. The metal plate 214 disposed under thelift pin 210 may be attracted by the magnetism of the magnet 222disposed above the flexure 220-2. Accordingly, the lift pin 210 and theflexure 220-2 may be magnetically coupled.

A guide part 224 may be formed on the upper side of the flexure 220-2 toguide the coupling of the lift pin 210 and the flexure 220-2. The guidepart 224 may protrude vertically from the top edge of the flexure 220-2so that the lift pin 210 can be inserted. For example, the guide part224 may protrude vertically toward the lift pin unit 200-2 and have aninclination and/or sloping sidewalls. In this way, the guide part 224 isconfigured to maintain the lift pin 210 in vertical alignment with thepin hole 122. The metal plate 214 of the lift pin 210 and the magnet 222of the flexure 220-2 may be vertically aligned by the guide part 224.

When the lift plate 140 is raised, the flexure 220-2 may be easilydeformed in the X and Y axis directions so that the lift pin 210 may bevertically aligned. The lift pins 210 may be vertically aligned in thepin holes 122 to prevent breakage of the lift pins 210.

FIG. 4B is a view illustrating a lift pin unit 200-3 and a lift plate140-3 according to one embodiment of the present disclosure.

Referring to FIG. 4B, the substrate processing apparatus 10-3 mayinclude a chuck 120, a plurality of lift pin units 200-3, and a liftplate 140-3.

The lift pin unit 200-3 may include a lift pin 210, a flexure 220-3, anda weight body 230.

A guide part 224 may be formed on the upper side of the flexure 220-3 toguide the coupling of the lift pin 210 and the flexure 220-3. The guidepart 224 may protrude from the upper edge of the flexure 220-3 so thatthe lift pin 210 can be inserted. The metal plate 214 of the lift pin210 and the magnet 222 of the flexure 220 may be vertically aligned bythe guide part 224.

A slide stopper 142 may be formed on an upper surface of the lift plate140-3 to prevent the flexure 220-3 from sliding beyond a predeterminedrange.

A plurality of string holes 144 may be formed in the lift plate 140-3.Each of the string holes 144 may be formed at positions corresponding toa respective lift pin units 200-3. A weight string 232 may connect theflexure 220-3 and the weight body 230. The first side of the weightstring 232 may be connected to the lower portion of the flexure 220-3.The second side of the weight string 232 may be connected to the weightbody 230.

Each weight string 232 may pass through the lift plate 140-3 through acorresponding string hole 144. The weight of the weight body 230 isadded to the weights of the lift pins 210 and the flexure 220-3 so thatthe lift pins 210 may be vertically aligned.

Even if the lift plate 140-3 is inclined, the lift pins 210 may bevertically aligned by gravity acting on the weight body 230, therebypreventing and/or suppressing damage to the lift pins 210. In addition,the flexure 220-3 may be deformed to the X and Y axes by the pressureapplied when the lift plate 140-3 is raised. The lift pins 210 may bevertically aligned in the pin holes 122 to prevent breakage of the liftpins 210.

FIG. 5 is a view illustrating an example of the flexure 220-4.

Referring to FIGS. 1 and 5 , the lift pin unit 200-4 may include a liftpin 210 and a flexure 220-4.

Flexure 220-4 may be a spring-type flexure, for example flexure 220-4may comprise a spring structure. The spring-type flexure 220-4 may bebonded, coupled, or fastened to the lower portion of the lift pin 210. Ametal plate may be disposed below the lift pins 210, and a magnet may bedisposed above the flexure 220-4 to magnetically couple the lift pins210 and the flexure 220-4 to each other. Additionally, the lift pin 210and the flexure 220-4 may be fastened to each other by using a screw,for example.

When the lift plate 140 is raised, the flexure 220-4 may be easilydeformed in the X-axis and Y-axis directions due to the elasticity ofthe spring-type flexure 220-4 so that the lift pins 210 can bevertically aligned. The flexure 220-4 may be an elastomeric material,for example. The lift pins 210 may be vertically aligned in the pinholes 122 (see FIGS. 1 and 3A) to prevent breakage of the lift pins 210.

FIG. 6 is a view illustrating an example of a flexure 220-5.

Referring to FIGS. 1 and 6 , the lift pin unit 200-5 may include a liftpin 210 and a flexure 220-5.

The flexure 220-5 may include a plurality of cutout parts 220-5 aconfigured to allow flexure 220-5 to be easily deformed horizontally inthe X and Y axis directions. Additionally, grooves may be formed on thebottom surface 220-5 b of the flexure 220-5 to prevent the lift pins 210from being inclined by particles such as dust or other foreign objects.For example, the bottom surface 220-5 b may contact the lift plate 140at the grooves and any particles may fit between the grooves.Additionally, the grooves may comprise a plurality of raised outdentsand a plurality of recessed indents or a cross hatch pattern.

Portions of the circumference of the cylindrical structure of theflexure 220-5 may be cut (recessed) in the X-axis, Y-axis, and obliquedirections thereof to form a plurality of cutout parts 220-5 a. Whenpressure is applied to the flexure 220 by lifting the lift plate 140,the plurality of cutout parts 220-5 a formed in the flexure 220extending in the X and Y axis directions, can be easily deformed. Forexample, the cutout parts 220-5 a may be configured as recessed groovesthat are configured to enable the flexure 220-5 to deform in the X and Yaxis directions and/or the X and Y axis directions obliquely due toflexural force applied to the flexure 220-5. The lift pin 210 may bevertically aligned in the pin hole 122 (refer to FIGS. 1 and 3A) as theflexure 220-5 is deformed in the X and Y axis directions. The lift pins210 may be vertically aligned in the pin holes 122 to prevent breakageof the lift pins 210.

FIG. 7 is a view illustrating a lift pin unit 200-6 and a lift plate140-6 according to an exemplary embodiment of the present disclosure.

Referring to FIG. 7 , the substrate processing apparatus 10-6 mayinclude a chuck 120, a plurality of lift pin units 200-6, and a liftplate 140-6.

The lift pin unit 200-6 may include a lift pin 210 and a flexure 220-6.

The flexure 220-6 may be bonded, coupled, or fastened to the lowerportion of the lift pin 210. A metal plate 214 (first metal plate)formed of a metal having magnetic properties (for example, iron, nickel,cobalt, etc.) may be disposed below the lift pin 210. The metal plate214 disposed under the lift pin 210 may be attracted by the magnetism ofthe magnet 222 disposed above the flexure 220-6. Accordingly, the liftpin 210 and the flexure 220-6 may be magnetically coupled.

When the lift plate 140-6 is raised, the flexure 220-6 may be easilydeformed in the X-axis and Y-axis directions so that the lift pins 210are vertically aligned. For example, the exemplary embodimentillustrated in FIG. 7 may include a flexure 220-6 having a serpentineshape with recessed portions that are configured to enable the flexure220-6 to deform in the X and Y axis directions and/or the X and Y axisdirections obliquely due to flexural force applied to the flexure 220-5.The lift pins 210 may be vertically aligned in the pin holes 122 toprevent breakage of the lift pins 210.

A slide stopper 142 may be formed on an upper surface of the lift plate140-6. The slide stopper 142 may prevent the flexure 220-6 from slidingbeyond a predetermined range.

In order to vertically align the lift pins 210, a metal plate 226(second metal plate) may be formed under the flexure 220-6. The magnet146 may be formed on an upper surface of the lift plate 140-6 and may bea permanent magnet, for example. Here, the magnet 146 of the lift plate140-6 may be disposed at a location between the slide stopper 142 thatcorresponds to the pin hole 122. For example, magnet 146 may be disposedin a recessed portion of the lift plate 140-6 between the slide stopper142 such that the uppermost surface of the magnet 146 is at the samelevel as an uppermost surface of the lift plate 140-6.

When the lift plate 140-6 is raised and lowered, the metal plate 226disposed below the flexure 220-6 may be attracted by the magnetism ofthe magnet 146 disposed on the upper surface of the lift plate 140-6.Accordingly, the magnet 146 and the metal plate 226 may be coupled bymagnetic force. For example, when the lift plate 140-6 is lowered to alift down state the coupling between the metal plate 226 and magnet 146may be broken (not in direct contact) and when the lift plate 140-6 israised to a lift up state the coupling between the metal plate 226 andmagnet 146 may be joined (in direct contact). See, for example, FIGS. 1and 2 . The lift pins 210 may be vertically aligned in the pin holes 122to prevent breakage of the lift pins 210.

FIG. 8 is a view illustrating a lift pin unit 2007-7 and a lift plate140-7 according to an exemplary embodiment of the present disclosure.

Referring to FIG. 8 , the substrate processing apparatus 10-7 mayinclude a chuck 120, a plurality of lift pin units 200-7, and a liftplate 140-7.

The lift pin unit 200-7 may include a lift pin 210 and a flexure 220-7.

The metal plate 214 disposed under the lift pin 210 may be attracted bythe magnetism of the magnet 222 disposed above the flexure 220-7.Accordingly, the lift pin 210 and the flexure 220-7 may be magneticallycoupled.

A guide part 224 may be formed on the upper side of the flexure 220-7 toguide the coupling of the lift pin 210 and the flexure 220-7. The metalplate 214 of the lift pin 210 and the magnet 222 of the flexure 220-7may be vertically aligned by the guide part 224.

When the lift plate 140-7 is raised, the flexure 220-7 may be easilydeformed in the X and Y axis directions so that the lift pins 210 may bevertically aligned. The lift pins 210 may be vertically aligned in thepin holes 122 to prevent breakage of the lift pins 210.

A stopper groove 148 having a predetermined depth may be formed on anupper surface of the lift plate 140-7. The stopper groove 148 may haveinclined sides and a substantially flat lower surface. The stoppergroove 148 may be formed to correspond to the pin hole 122 in locationand/or size. When the lift plate 140-7 rises, a lower portion of theflexure 220-7 may be inserted into the stopper groove 148. A lowerportion of the flexure 220-7 may be inserted into the stopper groove148, so that the flexure 220-2 may be prevented from sliding beyond apredetermined range due to an upward pressure. The lift pins 210 may bevertically aligned in the pin holes 122 to prevent breakage.

FIG. 9 illustrates a lift pin unit 200-8 and a lift plate 140-8according to an exemplary embodiment of the present disclosure.

Referring to FIG. 9 , the substrate processing apparatus 10-8 mayinclude a chuck 120, a plurality of lift pin units 200-8, and a liftplate 140-8.

The plurality of lift pin units 200-8 may include a lift pin 210, aweight block 240, a weight body 230, and a weight string 232.

The weight block 240 and the weight body 230 may be connected by theweight string 232. The weight block 240 may be positioned above the liftplate 140-8, and the weight body 230 may be located below the lift plate140-8.

A metal plate 214 formed of a metal having magnetic properties (forexample, iron, nickel, cobalt, etc.) may be disposed below the lift pin210. The metal plate 214 may be coupled or bonded to the lower portionof the lift pin 210. A magnet 242 may be formed on the weight block 240.

The metal plate 214 disposed under the lift pin 210 may be attracted bythe magnetism of the magnet 242 disposed on the weight block 240.Accordingly, the lift pin 210 and the weight block 240 may be coupled bymagnetic force. Additionally, and/or alternatively, the lift pin 210 andthe weight block 240 may be fastened to each other through a screw oradhesive, for example.

A slide stopper 142 corresponding to the pin hole 122 may be formed onan upper surface of the lift plate 140-8. The slide stopper 142 may beformed to have the same diameter as the diameter of the pin hole 122.Additionally, and/or alternatively, the slide stopper 142 may be formedto have a diameter (or width) larger than the diameter of the pin hole122. When the lift plate 140-8 is raised and lowered, the weight block240 may be located inside the slide stopper 142. The weight body 230 maybe vertically aligned with respect to the pin hole 122 by the slidestopper 142.

A plurality of string holes 144 may be formed in the lift plate 140-8.The plurality of string holes 144 may be formed at positionscorresponding to the positions of the plurality of lift pin units 200-8.The weight string 232 may connect the weight block 240 and the weightbody 230. The first side of the weight string 232 may be connected tothe lower portion of the weight block 240. The second side of the weightstring 232 may be connected to the weight body 230. The weight string232 connecting the weight block 240 and the weight body 230 through theplurality of string holes 144 may pass through the lift plate 140-8. Thelift pin 210 may be vertically aligned by the weight of the lift pin 210and the weight of the weight body 230.

When the lift plate 140-8 is raised and lowered, the lift pins 210 maybe vertically aligned by the weight body 230. Even if the lift plate140-8 is inclined, the lift pins 210 may be vertically aligned by theweight body 230, thereby preventing and/or suppressing damage to thelift pins 210.

FIGS. 10 to 12 are views illustrating a method of operating a substrateprocessing apparatus according to an embodiment of the presentdisclosure.

Referring to FIGS. 1, 2, 3A, and 10 , when the process is completed inthe chamber 110, the substrate 20 may be unloaded. At this time, thelift plate 140 is raised, and the lift pin 210 is raised. As the liftpin 210 rises, the substrate 20 rises. When the substrate 20 rises, thesubstrate 20 is unloaded out of the chamber 110 using a robotic arm.After the substrate 20 is unloaded, the lift plate 140 descends, and thelift pin 210 descends.

In order to proceed with the manufacturing process, the substrate 20 maybe loaded into the chamber 110. At this time, the lift plate 140 israised, and the lift pin 210 is raised. The substrate 20 may be disposedon the lift pin 210 that is raised by using the robotic arm. Thereafter,the lift plate 140 is lowered, and the lift pin 210 is lowered. As thelift pin 210 descends, the substrate 20 may be seated on the chuck 120.

When unloading and loading the substrate 20, the lift plate 140 may beraised from the lowest point (e.g., about 3.5 mm above the bottominterior surface of the chamber) to the highest point (e.g., about 20 mmabove the bottom interior surface of the chamber). Additionally, thelift plate 140 may be lowered from the highest point to the lowestpoint. In this case, a first time (for example, about 53 seconds) isrequired for unloading and loading the substrate 20, a lower thanoptimal manufacturing efficiency.

Referring to FIGS. 1, 2, 3A, and 11 , unloading and loading time of thesubstrate 20 can be reduced and a manufacturing efficiency can beoptimized.

When unloading the substrate 20, the lift plate 140 may be raised to thehighest point. Thereafter, the substrate 20 may be unloaded to theoutside of the chamber 110 using the robotic arm. After the substrate 20is unloaded, the lift plate 140 may descend. In this case, the liftplate 140 may be lowered to an intermediate point (e.g., 11 mm above thebottom interior surface of the chamber) without descending to the lowestpoint. Here, the intermediate point may be a height at which thesubstrate 20 may be seated on the chuck 120.

When the substrate 20 is loaded, the lift plate 140 may rise from theintermediate point to the highest point. The substrate 20 may bedisposed on the lift pin 210 that is raised by using the robotic arm.Thereafter, the lift plate 140 may descend to the lowest point. As thelift pin 210 descends, the substrate 20 may be seated on the chuck 120.

As such, when the lift plate 140 is positioned at the intermediate pointduring the unloading and loading of the substrate 20, a second time (forexample, 46 seconds) for unloading and loading the substrate 20 passes,which can increase manufacturing efficiency. Here, when the lift plate140 is stopped at the intermediate point, the lift pin 210 may be tiltedand pinched in the pin hole 122.

Even when the lift plate 140 is raised in a state in which the lift pin210 is pinched inside the pin hole 122, the flexure 220 may be bent tostraighten the lift pin 210 in the vertical direction. As the flexure220 is deformed in the X-axis and Y-axis directions, the lift pins 210are vertically aligned in the pin holes 122, thereby preventing and/orsuppressing breakage of the lift pins 210.

Referring to FIGS. 1, 2, 3A, and 12 , unloading and loading time of thesubstrate 20 may be reduced, and breakage of the lift pin 210 may beprevented and/or suppressed.

When the substrate 20 is unloaded, the lift plate 140 may rise to thehighest point, and the substrate 20 may be unloaded to the outside ofthe chamber 110 by using the robotic arm. After the lift plate 140 risesto the highest point, the lift plate 140 may descend. In this case, thelift plate 140 may be lowered to the intermediate point (e.g., 11 mmabove the bottom interior surface of the chamber) without descending tothe lowest point.

When loading the substrate 20, the lift plate 140 positioned at theintermediate point may further be lowered by a predetermined distance(for example, 1 to 2 mm additional lowering). After the lift plate 140is further lowered by the predetermined distance, the lift plate 140 mayrise to the highest point. That is, when the substrate 20 is loaded, thedriving of the lift plate 140 may occur. Here, the lift plate 140 maydescend to a first point (e.g., 9 to 10 mm) lower than the intermediatepoint. Thereafter, the lift plate 140 may rise to the highest point.

The lift plate 140 may rise to the highest point to position the liftpin 210 at the highest point. Thereafter, the substrate 20 may bedisposed on the lift pin 210 that is raised using the robotic arm.Thereafter, the lift plate 140 may descend to the lowest point (e.g.,3.5 mm above the bottom interior surface of the chamber). As the liftpin 210 descends, the substrate 20 may be seated on the chuck 120.

As such, when the substrate 20 is loaded, the lift plate 140 may beadditionally lowered by about 1 to 2 mm from the intermediate pointwhere the previous substrate was unloaded from. In this case, a thirdtime (for example, 48 seconds) passes to unload and load the substrate20, thereby increasing manufacturing efficiency.

When the lift plate 140 is stopped at the intermediate point, the liftpin 210 may be inclined and the lift pin 210 may be pinched in the pinhole 122. In this case, when the lift plate 140 is further lowered byabout 1 to 2 mm from the intermediate point, the lift pin 210 may bevertically aligned while descending. Thereafter, the lift plate 140 maybe raised from the first point (9 to 10 mm above the bottom interiorsurface of the chamber) to the highest point. When the lift plate 140 israised and lowered, the lift pins 210 may be vertically aligned in thepin holes 122 to prevent breakage of the lift pins 210.

In addition, when the lift pin 210 is inclined in the pin hole 122, theflexure 220 may be deformed in the X-axis and Y-axis directions. Thelift pins 210 may be vertically aligned in the pin holes 122 to preventbreakage.

FIG. 13 illustrates a flow chart for a method of manufacturing asemiconductor device. At step 1301, a substrate processing apparatus maybe provided. The substrate processing apparatus may be the same as orsimilar to the substrate processing apparatus of FIGS. 1 and 2 , and mayinclude aspects of the lift pin units 200, lift pins 210, lift plate140, etc. of FIGS. 3A-9 . At step 1303, a first substrate 20 may beloaded into a chamber of the substrate processing apparatus.

When loading the first substrate 20, the lift plate 140 may be raisedfrom a low point (e.g., about 3.5 mm above the bottom interior surfaceof the chamber) to a high point (e.g., about 20 mm above the bottominterior surface of the chamber). A robotic arm may insert the firstsubstrate 20 into the chamber when the lift plate 140 is at the highpoint. At step 1305, the first substrate 20 may be seated on the chuck120 of the substrate 20 processing apparatus. The first substrate 20 maybe seated on the chuck 120 by lowering the lift plate 140 from the highpoint to an intermediate point (e.g., 11 mm above the bottom interiorsurface of the chamber) without descending to the lowest point. At step1307, the first substrate 20 may be lowered to the lowest point.Thereafter, at step 1309, the first substrate 20 may be unloaded at thehigh point. At step 1311, the robotic arm may insert a second substrate20 into the chamber when the lift plate 140 is at the high point. Thosewith skill in the art will readily understand that additionalundisclosed manufacturing steps that are known in the art may beperformed on the substrate.

Throughout the method of manufacturing a semiconductor device, thevertical alignment of the lift pins 210 is maintained with the verticalalignment of the corresponding lift pin holes 122. For example, when thelift plate 140 is raised and lowered, the plurality of lift pins 210 maycontact the substrate 20. The plurality of lift pins 120 may each bevertically aligned in a respective pin hole 122 to prevent breakage ofthe lift pins 210. In addition, if the lift pin 210 is inclined in thepin hole 122, the flexure 220 may be deformed in the X-axis and Y-axisdirections. This deformation may enable the lift pins 210 to bevertically aligned in the pin holes 122 to prevent and/or suppressbreakage.

While the embodiments of the inventive concept have been described withreference to the accompanying drawings, it should be understood by thoseskilled in the art that various modifications may be made withoutdeparting from the scope of the inventive concept and without changingessential features thereof. Therefore, the above-described embodimentsshould be considered in a descriptive sense only and not for purposes oflimitation.

Ordinal numbers such as “first,” “second,” “third,” etc. may be usedsimply as labels of certain elements, steps, etc., to distinguish suchelements, steps, etc. from one another. Terms that are not describedusing “first,” “second,” etc., in the specification, may still bereferred to as “first” or “second” in a claim. In addition, a term thatis referenced with a particular ordinal number (e.g., “first” in aparticular claim) may be described elsewhere with a different ordinalnumber (e.g., “second” in the specification or another claim).

What is claimed is:
 1. A substrate processing apparatus including: achuck including a plurality of pin holes; a plurality of lift pinspositioned to rise and fall through the plurality of pin holes; a liftplate configured to raise and lower the plurality of lift pins; a firstlift pin included among the plurality of lift pins, the first lift pinhaving a rod shape configured to move up and down in a pin hole of theplurality of pin holes; a flexure coupled to a lower portion of thefirst lift pin and positioned between the chuck and the lift plate; aweight body positioned underneath the lift plates; and a weight stringconnecting the flexure and the weight body, wherein the lift plateincludes a string hole through which the weight string passes through.2. The substrate processing apparatus of claim 1, wherein the pin holeincludes an upper side and a lower side that each includes afunnel-shaped recess.
 3. The substrate processing apparatus of claim 1,further comprising: a first metal plate disposed below the first liftpin, and a first magnet disposed on top of the flexure.
 4. The substrateprocessing apparatus of claim 1, wherein the lift plate furthercomprises a slide stopper, wherein the slide stopper corresponds to thepin hole, and the slide stopper surrounds the flexure.
 5. The substrateprocessing apparatus of claim 1, further comprising a guide part formedon an upper side of the flexure, wherein the guide part protrudes froman upper edge of the flexure, and the first lift pin is configured to beinserted into the guide part.
 6. The substrate processing apparatus ofclaim 1, wherein the pin hole and the string hole are verticallyaligned.
 7. The substrate processing apparatus of claim 1, wherein theflexure comprises a spring structure.
 8. The substrate processingapparatus of claim 1, wherein the flexure comprises a cylindricalstructure, and the cylindrical structure includes a plurality of cutoutparts in the X-axis, Y-axis, and oblique directions.
 9. A substrateprocessing apparatus including: a chamber; a chuck disposed in thechamber, the chuck including a plurality of pin holes; a plurality oflift pins positioned to rise and fall through the plurality of pinholes; a lift plate configured to raise and lower the plurality of liftpins; a first lift pin included among the plurality of lift pins, thefirst lift pin having a rod shape and configured to move up and downwithin a pin hole of the plurality of pin holes; a flexure coupled to alower portion of the first lift pin and positioned between the chuck andthe lift plate; a first metal plate disposed below the first lift pin;and a first magnet disposed on a top of the flexure.
 10. The substrateprocessing apparatus of claim 9, further comprising: a second magnetdisposed on an upper surface of the lift plate, the second magnetcorresponding to the pin hole, and a second metal plate disposedunderneath the flexure.
 11. The substrate processing apparatus of claim9, wherein the lift plate further includes a stopper groovecorresponding to the pin hole, and wherein the flexure is configured tobe inserted into the stopper groove.
 12. The substrate processingapparatus of claim 9, wherein the pin hole includes an upper side and alower side that each includes a funnel-shaped recess.
 13. The substrateprocessing apparatus of claim 9, wherein the flexure comprises a springstructure.
 14. The substrate processing apparatus of claim 9, whereinthe flexure comprises a cylindrical structure, and portions of thecylindrical structure include a plurality of cutout parts in the X axis,Y axis, and oblique directions.
 15. A substrate processing apparatuscomprising: a chamber; a chuck disposed in the chamber, the chuckincluding a plurality of pin holes; a plurality of lift pins positionedto rise and fall through the plurality of pin holes; a lift plateconfigured to raise and lower the plurality of lift pins; a first liftpin included among the plurality of lift pins, the first lift pin havinga rod shape and configured to move up and down within a pin hole of theplurality of pin holes; a flexure coupled to a lower portion of thefirst lift pin and positioned between the chuck and the lift plate; anda guide portion disposed above the flexure, the guide portion protrudingfrom an upper edge of the flexure, and the first lift pin beingconfigured to be inserted into the guide portion.